NPL to Meet on Measurements of Copper Dissolution in Pb-Free Solder
Published: 10 November 2006
by Staff
OXFORDSHIRE, UK – The National Physical Laboratory will hold a meeting on copper dissolution in lead-free alloys on Dec. 7 in Oxfordshire.
According to NPL, the meeting will launch a program that intends to study various lead-free alloys under different temperatures and soldering technologies. The group plans to develop a measuring method for testing alloys.
The agenda will be set by the group’s specific production needs, designs, equipment, alloys and PCB finishes. Participants will gain access to experimental results before the end of the project.
NPL wants to develop a monitoring technique to quantify the rate of copper loss as a result of immersion in a molten metal under static and dynamic conditions; investigate copper dissolution with a range of solder alloys, PCB styles and temperatures; and produce a best practice guide to include a test method for minimizing PCB copper dissolution.
Solder manufacturers, wave soldering manufacturers and end-users are expected to make up the program team.
According to NPL, the meeting will launch a program that intends to study various lead-free alloys under different temperatures and soldering technologies. The group plans to develop a measuring method for testing alloys.
The agenda will be set by the group’s specific production needs, designs, equipment, alloys and PCB finishes. Participants will gain access to experimental results before the end of the project.
NPL wants to develop a monitoring technique to quantify the rate of copper loss as a result of immersion in a molten metal under static and dynamic conditions; investigate copper dissolution with a range of solder alloys, PCB styles and temperatures; and produce a best practice guide to include a test method for minimizing PCB copper dissolution.
Solder manufacturers, wave soldering manufacturers and end-users are expected to make up the program team.
