HERNDON, VA - The International Electronics Manufacturing Initiative’s (iNEMI’s) workshop on the availability of SnPb-compatible BGAs, originally scheduled for January 24, has been moved to March 1. Hosted by Hewlett-Packard, the workshop will occur at its Cupertino, CA campus.

The workshop is intended to facilitate discussion among high-reliability electronic product manufacturers and makers of electronic components manufactured in ball grid array (BGA) packages.  

iNEMI’s SnPb BGA Availability Task Group has assembled information that will be shared with BGA device makers, including a list of critical BGA component families; estimated total available market (TAM) for these devices in SnPb assembly versions; a general business case based on TAM; and scenarios to support this critical market need until reliability issues are resolved for high-reliability, long-life electronic assemblies.

Workshop registration information and directions are available at http://www.inemi.org/cms/projects/ese/SnPb_BGAs.html.