BANNOCKBURN, IL – IPC launched a global survey of OEMs this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study.

The OEM survey covers technical requirements that support the development of products using the Internet of Things, artificial intelligence, sensor inputs and neural networks, and key technical issues including frequency and reliability. Technical requirements for PCBs are covered, including such properties as thickness, layers, line width and spaces, aspect ratios, I/O pitch, thermal properties, materials and finishes.

Respondents may answer the questions that relate to their type of operations, focusing on one specific end-use application, such as automotive, communications, computers, consumer, defense and aerospace, industrial, or medical and instrumentation.

A global survey of PCB fabricators will also be launched later this month to collect data from PCB fabricators on their current technical capabilities and the potential for expanded capabilities over the next five years.

Together the data on OEM specifications and PCB capabilities will produce detailed aggregate data on the current and future state of PCB technology and OEMs’ technical requirements, and the outlook for future technology developments through 2023.

Survey participants will receive a complimentary copy of the 2018 PCB Technology Trends report.

Electronics manufacturers interested in participating are invited to contact IPC’s market research staff at marketresearch@ipc.org.

The deadline for OEM survey responses is July 6.

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