AUSTIN, TX – Artificial intelligence accelerators found in data centers require high-density packages to support logic, plus high bandwidth memory (HBM), according to the latest TechSearch International research.

Many silicon interposer designs are in mass production, and Intel’s EMIB is also used. Package-on-package (PoP) is used for smartphone processors incorporating AI. FO-WLP and MCeP PoP versions are in production. A variety of packages, including QFNs and WLPs, are found in Smart Home Speakers and Hubs.

New package options under development include embedded ceramic bridge and organic interposers.

TechSearch’s recent report examines the growing shortage of components and provides analysis of OSAT financials. A section on micro LEDs, stacked CMOS image sensors, and a peek inside Samsung’s latest Galaxy smartphone are included. The report also examines laminate substrate package design rules and the materials used by each supplier.

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