SAN DIEGO – The program for the Executive Forum on Advancing Automotive Electronics at IPC Apex Expo 2019 is complete.

The forum is designed for executives in the automotive electronics system supply chain and follows the recent announcement of the IPC Transportation Electronics Reliability Council.

It includes an overview of the IPC’s role in automotive electronics by IPC President and CEO Dr. John Mitchell, as well as presentations by Tier 1 providers from Robert Bosch in Germany and APTIV (formerly Delphi) in the US.

In a keynote, Alex Stepinski, VP of Greensource Fabrication, will discuss recent innovations that enable the construction of circuit production lines with the capability for single piece flow, autonomous work cells, and extreme traceability capabilities that can yield higher quality levels and shorter cycle times than before, while at the same time eliminating the traditional environmental footprint of a PCB fab.  Examples of these innovations and how they relate to the future of the automotive industry supply chain will be presented.

There are presentations from substrate and specialty chemical companies in Europe, Ventec and Elga Europe that developed materials for automotive applications.

Joe D’Ambrisi, global VP electronics marketing and technology, and Don Cullen, director of marketing communications, MacDermid Alpha Electronic Solutions, will present The Global Outlook for Specialty Chemicals and Materials in Automotive Electronic Packaging.

Larry Wilson III, the leader of Nexteer Automotive’s Global Electronics costing team, will provide a cost history and forecast of automotive electronics.

The CTO of MicoteK Labs China will present PCB Reliability Testing for Automotive Electronics – The China Story.

Randy Hierman, VP of OptimalPlus, will present Striving for Zero DPPM.

To register, visit www.ipcapexexpo.org.

For more information, contact Gene Weiner at gene@weiner-intl.com.