MINNEAPOLIS, MN – The SMTA announced the Best Papers from SMTAI 2018. Richard Coyle, Ph.D., Nokia Bell Labs and a team of coauthors from the iNEMI/HDPUG 3rd Generation Pb-Free Alloys Project won the Best of Proceedings category for "Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys."

David Hillman and coauthors from Collins Aerospace came in second for “Dissolution Rate of Specific Elements in SAC305 Solder.” Richard Coyle, Ph.D., Nokia Bell Labs, David Ihms, Ph.D., Delphi Technologies, and additional coauthors from the iNEMI QFN Board Level Reliability Project took third place for “The Influence of Printed Circuit Board Thickness on the Thermal Fatigue of Quad Flat No-Lead Packages.”

The winner for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Kazuhiro Nogita, The University of Queensland, for the presentation "The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates."

The Best Student Presentation was awarded to Vishnu Reddy, Georgia Tech, for his paper “Assessment of 2nd level interconnect quality in Flip Chip Ball Grid Array (FCBGA) Package using Laser Ultrasonic Inspection Technique.”

To participate in the 2019 SMTAI conference, visit https://smta.org/smtai/call_for_papers.cfm.  

Abstracts will be accepted through Mar. 1.