MINNEAPOLIS, MN – SMTA released the Guide to BGA Assembly & Soldering Defects, a complimentary book written by a longtime inspection expert.

The full-color booklet features images of optical and x-ray examples of common and not-so-common defects affecting ball grid array and area array components during assembly. The examples include cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures.

The new book was authored by Keith Bryant, chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.  

For more information, visit https://www.smta.org/knowledge/defect-guide/.