MINNEAPOLIS, MN – The best papers from SMTA International 2019 were announced. Chris Gourlay, Imperial College London, won the Best of Proceedings category for the paper "Phase Formation and Solid Solubility in High-Reliability Pb-Free Solders Containing Bi, Sb, In."

Richard Coyle, Ph.D., Nokia Bell Labs, came in second for the paper “Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability.”

Yoshinori Ejiri, Hitachi Chemical, took third place for the paper “Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction.”

The winner for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, was Michael Konrad, Aqueous Technologies, for the presentation "IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?"

Best Student Presentation was awarded to Faramarz Hadian, Binghamton University, for the paper “Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy.”

The authors will be presented awards during SMTAI Sept. 27-Oct. 1, 2020, in Rosemont, IL.