MORRISVILLE, NC – iNEMI will hold three webinars next month to discuss results of its wafer/panel level package flowability and warpage project.

The project focused on increasing understanding of the molding process and developing simulation approaches. The objective was to identify the material factors and key process parameters important for achieving higher yield in flow and warpage control for mold first WLP/PLP assembly processes.

The project conducted physical experiments and simulation analyses with a simplified case study on a 300 x 300mm panel, consisting of 10 x 10mm bare silicon die and epoxy mold compound of 500µm thickness.

The final panel warpage observed in experiments were combined effects of gravity, chemical shrinkage and CTE mismatch. iNEMI says there previously wasn’t a means to accurately separate the contributions from each element, but this project introduced a technique that can do so through experimental procedures and numerical simulations.

The webinars will take place Apr. 7, 8 and 16 and will review the team’s results and recommendations.

To register for session one (APAC and Americas), visit https://tinyurl.com/rv2a8yf.

To register for session two (APAC and EMEA), visit https://tinyurl.com/tkxyvwd.