MORRISVILLE, NC – iNEMI will hold a webinar on its PCB Warpage Characterization and Minimization project May 13 and 14.

iNEMI’s PCB Warpage Characterization and Minimization project studied key design and fabrication factors for thin PCBs to determine the impact on warpage. The project analyzed the effects of PCB post-processing (bake and no bake PCB); panel locations (corner and center); PCB thicknesses (0.8mm and 0.6mm); material properties (mid Tg and high Tg); and PCB fabrication processing.

The resulting PCB warpage was evaluated using high-temperature warpage measurement metrology to evaluate the BGA and panel area PCB coplanarity.

The project team will report on the analysis of the results and recommendations.

To register for Session 1 (Americas and EMEA) (May 13), visit https://tinyurl.com/y8zlk8vj.  

To register for Session 2 (APAC and Americas) (May 14), visit https://tinyurl.com/y8xywkez.