WATERBURY, CT – Three suppliers in electronics assembly materials received notice the US Patent and Trademark Office has issued a patent for their solder alloy formulation. The patent was granted an extended expiration to June 11, 2029.

MacDermid Alpha Electronics Solutions, Henkel, and Heraeus developed a Pb-free solder alloy for harsh environment electronics applications (Innolot and Loctite 90ISC). The alloy is designed to tolerate the demands of high-temperature applications, while being solderable at standard Pb-free process temperatures.

“The issuing of this patent is of strategic and commercial importance,” said Tom Hunsinger, vice president of marketing, MacDermid Alpha Electronics Solutions. “Coupled with patent protection in Europe and Japan, this will help drive new business opportunities not only in automotive but in other markets with harsh environment challenges.”