HONG KONG – ASMPT will provide integrated solutions for heterogeneous integration, including ALSI laser saw/grooving and interconnect tools, in support of IBM artificial intelligence research.

“The future of AI computing performance depends on the development of hardware that meets the fast-growing demands of emerging AI workloads,” said Mukesh Khare, Ph.D., vice president, Systems Research at IBM Research. “We are pleased to work with ASMPT on advance packaging and heterogeneous integration solutions for AI hardware research in the IBM Research AI Hardware Center."

"The exponential cost of recent silicon scaling has created an inflection point for the industry,” said Lim Choon Khoon, senior vice president at ASMPT. “It is driving the development of heterogeneous integration to augment step-up performance versus comparable systems on chip. This is being achieved through HI's open capability to disintegrate and reintegrate silicon and chiplets, allowing flexible choices to achieve optimal performance at significantly lower costs. The timely confluence between IBM's heterogeneous integration roadmap and ASMPT's advanced packaging technologies and tools makes us natural strategic collaboration partners to tap the massive potential for innovation and better performance in semiconductor solutions."

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