QINGDAO, CHINA – Foxconn recently broke ground on a ¥60 billion (US$8.6 billion) semiconductor assembly and test plant here, according to reports. Rongkong Group will co-finance the project.

The factory will provide advanced packaging technologies, such as fan-out and wafer-level bonding and stacking, for chips used in 5G and AI-related device applications.

The site will begin production in 2021 and scale up to commercial levels by 2025, with monthly capacity of 30,000 12" wafers.

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