IRVINE, CA – TopLine Corp.’s chief executive has filed for a US patent for a Pb-free solder column used in the manufacture of FPGA devices. The product has been developed in anticipation of RoHS requirements for Pb-free columns.

“Historically, the aerospace and defense industry has largely been exempt from meeting the requirements of the EU RoHS directive regulating the use of lead in solder columns,” said Martin Hart, CEO, TopLine. “It is widely speculated that one day RoHS will stop renewing its exemption, allowing lead-bearing solder balls and solder columns. Doing so could trigger unintentional consequences by forcing ODMs to convert to fully Pb-free FPGA products. This product is designed to anticipate and meet future needs for Pb-free columns.”

Heritage hardware used in the aerospace and defense industries is built on a platform of FPGA devices built with solder columns instead of solder balls, he said. CGA FPGA packages engaged in mission-critical black box systems have shown to be more reliable than BGA packages, absorbing stress and increasing solder joint reliability under harsh operating conditions, Hart added.

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