BANNOCKBURN, IL – IPC this month released new revisions to the two primary standards for electronics assembly performance and qualification: IPC J-STD-001H, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H, Acceptability of Electronic Assemblies.

The H revision of IPC-A-610 removes all target conditions, following the steps in IPC/WHMA-A-620D. The standard includes new criteria on wrapped terminals. ESD was moved to an appendix. Board assembly and cable and wire harness were separated. General updates were made, and jumper wire criteria were folded into their own chapter.

IPC-J-STD-001G-AM1 is now incorporated into IPC-J-STD-001H. Section 8.0 “Cleaning and Residue Requirements,” deletes the 1.56μg/NaCI equivalence/cm² value for resistivity of solvent extract (ROSE), which has been determined no longer acceptable for qualifying a manufacturing process. IPC-WP-019B provides an explanation and rationale for Section 8.0. Appendix D was added to include using x-ray for acceptance for solder connection. References to the international space station symbol were removed. With the introduction of an automotive addendum, all reference symbols were removed from the base document. New criteria were included for wrapped terminals.

An accompanying white paper provides additional details supporting Section 8.0 of IPC-J-STD-001H requirements for cleaning and coating acceptance criteria.

Representatives from nearly 30 countries worked on the two documents.