AUSTIN, TX – The market for high bandwidth memory is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024, according to TechSearch International.

Increased adoption in high-performance computing such as AI, networking, graphics, and future server processors is driving growth.

Package options for HBM plus logic include silicon interposers, fan-out on substrate using a redistribution layer, and many bridge solutions. HBM uses TSVs and μbumps to achieve a 3-D format.