MORRISVILLE, NC – iNEMI will host a webinar on phase one of its 1st Level Interconnect Void Characterization Project Feb. 3 and 4.

The project has studied voids in flip-chip interconnect to determine their location and volume in an effort to understand how the voiding affects product reliability, and what level of voiding is acceptable while maintaining reliability requirements. This webinar will report on the results.

Session one is for the Americas on Feb. 3 and Japan Feb. 4. To register, visit https://tinyurl.com/yyd2hq27.

Session two is for the Americas, Europe, and Japan on Feb. 4. To register, visit https://tinyurl.com/y3nzb7rb.