MINNEAPOLIS – SMTA announced the best papers from SMTA International 2020. Richard Coyle, Ph.D., Nokia Bell Labs, won the Best of Proceedings category for "Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony."

Coauthors include Charmaine Johnson, Dave Hillman, and Tim Pearson, Collins Aerospace; Michael Osterman, CALCE; Joe Smetana, Nokia; Keith Howell, Nihon Superior; Hongwen Zhang and Ji Geng, Indium; Julie Silk, Keysight Technologies; Derek Daily, Senju Comtek; Babak Arfaei, SUNY-Binghamton; Ranjit Pandher, Alpha Technologies; Andre Delhaise, Celestica; Stuart Longgood, Delphi Technologies; and Andre Kleyner, Aptiv.

The following papers received honorable mention:

• Andrew Mawer, NXP Semiconductors, for "Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications." Coauthors include Mollie Benson, Dwight Daniels, A R Nazmus Sakib, and Vishrudh Sriramprasad, NXP Semiconductors.
• Jennifer Bennet, P.E., IBM, for "CBGA and CCGA Field Reliability Predictions Confirmed." Coauthors include Jim Bielick and Marie Cole, IBM.
• Karen Tellefsen, Ph.D., MacDermid Alpha Electronics Solutions, for "Advanced SIR Testing for Trapped Solder Paste Flux Residue." Coauthors include Aurkie Ray, Anna Lifton and Paul Salerno, MacDermid Alpha Electronics Solutions.
• Keith Sweatman, Ph.D., Nihon Superior, for "Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy." Coauthors include Tetsuro Nishimura, Nihon Superior; Sergey A. Belyakov and Christopher M. Gourlay, Imperial College London.

Authors will receive their awards during a ceremony at SMTA International 2021, which will be held Nov. 1-4 at the Minneapolis Convention Center.

Winners were selected by members of the conference technical committee. A cash award and plaque are given to primary authors of all winning papers.

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