TAIPEI – Orient Semiconductor Electronics plans to grow its EMS business beyond electronics and strengthen its collaboration with Chipbond Technology in 5G, IoT and automotive electronics, according to reports.

OSE will extend its EMS business into oil exploitation, aerospace satellites and military defense, in addition to PCB and SSD assembly and other segments such as IPCs, servers and high-end display cards.

The company will offer existing clients backend services through Chipbond, including CSP, BGA and SiP packaging processes.

OSE said it is pending client validation for 3-D NAND flash packaging technology and will incorporate high-end FC and fanout packaging processes for DDR5, LPDDR and other high-capacity memory chips for smart manufacturing systems and other applications.