AUSTIN, TX – Despite capacity increases this year, and additional plans through 2025, demand for FC-BGA substrates is outstripping supply, says TechSearch International. The gap between manufacturing demand and capacity will continue through 2025.

What’s driving the insatiable demand? Larger substrates are required to support high-performance applications, including silicon interposers larger than reticle size and large-area fan-out, says the firm.

With 7, 8, 9, or 10 build-up layers required on each side, more manufacturing capacity is needed to meet package demand for servers, AI, and network switching applications.