AUSTIN, TX — TechSearch International's latest Advanced Packaging Update describes some of the thermal challenges facing the industry from mobile to high-performance computing. With increased power dissipation, companies are moving to higher performance thermal interface materials and adopting new cooling methods including liquid immersion.

The report discusses these developments and describes thermal interface material offered by suppliers. The report includes OSAT financials and examines economic trends impacting the industry. China’s Covid lockdowns, new US exports controls, continued inflation, and the war in Ukraine are discussed. The report also examines the trends in EV charging with examples of the packages used for charging stations. Companies offering charging equipment and services are listed.

TechSearch International analyzes changes in the gap between manufacturing demand and capacity for build-up substrates. Lower demand for PCs and other products have improved the overall substrate supply and demand situation, but companies without long-term supply agreements are still finding build- up substrate procurement challenging. The report highlights plans for North American suppliers of substrates.

The latest Advanced Packaging Update is a 72-page report with full references and an accompanying set of more than 50 PowerPoint slides. Find the report at www.techsearchinc.com