ST. PETERSBURG, FL – Jabil has announced the expansion of its advanced photonics packaging new product introduction capabilities at its site in Ottawa, Canada.

The company said the expansion is part of a continued investment in silicon photonics-based products and capabilities to support the increasing demands of hyperscalers and next-wave cloud and AI data center growth, and the new capabilities will be rolled out in the fourth quarter.

The NPI line will feature capabilities designed to assist photonics customers quickly scale from proof of concept to mass production, such as fluxless flip-chip, fiber attachment, precise die bonding and wire bonding, the company said. The advancements will support silicon photonics chip packaging, particularly in high-speed connectivity applications such as co-packaged optics (CPO) and high-speed on-board connections, and will allow customers to benefit from enhanced performance and reliability in their photonics solutions, ultimately driving agility and scalability in their operations.

"The expansion of our Ottawa site is a game-changer for Jabil," said Matt Crowley, EVP, Global Business Units. "This facility will enable us to meet the growing demands for advanced photonics solutions tailored to AI and next-generation data centers. Through our NPI capabilities, we can assist customers in their own product development journeys, significantly reducing the need for costly trial and error in developing their own solutions from scratch."