POTSDAM, NY – Clarkson University researchers are developing TASChips, an open-source tool that performs real-time thermal analysis on modern microprocessors. By rapidly pinpointing on-die hotspots, the software helps engineers design systems that run faster, last longer and consume less energy, benefiting everything from smartphones and gaming consoles to AI and data-center processors.

TASChips is built to model even the largest AI/HPC devices and will be released on GitHub with documentation and case studies for researchers, educators and students. The project is led by associate professor Yu Liu and Professor Ming-Cheng Cheng in Electrical & Computer Engineering and is funded by a three-year, $597,316 National Science Foundation grant.

The team is also partnering with Syracuse University, Clemson University, University of Minnesota Morris and CISTER/ISEP (Portugal), with integrated STEM outreach and undergraduate research components to grow thermal-management expertise at scale.