SEOUL, SOUTH KOREA – MK Electron said it will expand production of solder paste and palladium (Pd) alloys as part of a broader strategy to drive growth across semiconductor packaging and SMT applications.

The company plans to increase capacity through new capital investments, though financial details were not disclosed. The move includes scaling solder paste production, where MK Electron has internalized the full manufacturing process, from solder powder production to flux blending and final paste formulation.

Palladium alloys, used in semiconductor test components such as pogo pins, are another focus area. The company plans to launch a new material offering extended lifespan compared with existing alloys, targeting improved performance and cost efficiency.

In parallel, MK Electron is evaluating expansion of its bonding wire business to meet rising demand tied to advanced memory packaging, including stacked DRAM modules that require higher wire usage. The company currently holds a leading global share in bonding wires.

To support margins, MK Electron is leveraging a closed-loop recycling system that recovers high-purity metals such as gold, silver, tin and palladium for reuse in production. The approach is aimed at reducing raw material costs while maintaining supply stability.