SMYRNA, GA – CIRCUITS ASSEMBLY opened its 2016 New Product Introduction Awards (NPI) for printed circuit board assembly.

The NPI Awards recognize the leading new products for PCB assembly introduced in the 2015 calendar year. Awards are selected by an independent panel of judges from the industry and presented by CIRCUITS ASSEMBLY. No preferential treatment is given to customers of CIRCUITS ASSEMBLY or UP Media Group.

Awards will be presented in the following categories: Equipment: automation tools (conveyors, feeders, etc.); bonders; cleaning equipment; component placement - high-speed; component placement - multifunction; component storage; device programming; dispensing equipment; labeling equipment; process control tools; rework and repair tools; screen/stencil printing; screen/stencil printing peripherals/consumables; soldering - reflow (convection); soldering – wave; soldering – selective; soldering – other (vapor phase, hot bar, laser, etc.); soldering – hand tools; test and inspection – AOI; test and inspection – AXI; test and inspection – ICT; test and inspection – SPI; test and inspection – functional test; first article inspection; Materials: adhesives; cleaning materials; coatings/encapsulants; underfills; flux; soldering materials (paste, bar, wire, core, etc.); cored wire; Software: software - process control; software – production; software – management (ERP, MRP, etc.).

The deadline for entries is January 11, 2016. To be eligible, entries must have been introduced to market (any region) no earlier than March 1, 2015.
Entries are judged on creativity and innovation; compatibility with existing technology; cost-effectiveness; design; expected reliability; flexibility; expected maintainability/reparability; performance; user-friendliness, and speed/throughput.
Awards will be presented during a ceremony on March 15, 2016, during the IPC Apex Expo in Las Vegas.

For more information, visit

To register, visit

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article