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microme|x is a high resolution x-ray inspection system with a large scanning area (20 x 24"), a precise manipulation unit with 360° rotation axis and the approved ovhm technology for oblique views up to 70° at constant magnification. Operators can inspect large boards with mixed assemblies and acquire real-time oblique views under all angles.

Has board handling unit connection for fully automated loading of assembled boards in the production plant. In connection with the inspection software, XE², can perform a fully automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. An interface for the CAD data import allows use of the original PCB layout to teach in the inspection routine. Inspection reports can be transferred to a rework station by the repair program quality. The SPC module allows statistical evaluation of the inspection results and the process supervision.

phoenix x-ray Systems + Services GmbH, phoenix-xray.com

Productronica Hall A2, Booth 277