MVP will display its wire bond capability with the high-speed AutoInspector Ultra II. Defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry and contamination can be detected with wire bond configuration.
 
3-D inspection and color camera solutions will also be presented for wire bond or other applications that benefit from color cameras. Flexible algorithms process the color image and enhance detection performance.
 
3-D inspection capability extends the AutoInspector Series defect coverage by adding 3-D coverage for paste inspection for the entire board or selected areas of the board, as well as for production sampling mode in which the system inspects 3-D based on a user-selected sampling rate. The modularity maximizes flexibility and provides for field upgrades capable for 0201s and microBGAs.
 
GEM Series Software version 5.0 is said to improve the overall ease of use of the system with a redesigned graphical interface for quick algorithm set-up and guidance in setting parameters. The software guides users on setting up the inspection parameters, for a significant improvement in productivity and reduction of training time. Enhancements include onscreen graphics, spreadsheet utilities, modular debug within each algorithm, and database and algorithm navigation tools.
 
Machine Vision Products Inc., sales@machinevisionproducts.com
Booth A2, 251