AlphaPREP PC-7030 oxide replacement system produces a highly bondable brown conversion coating on copper innerlayers using horizontal equipment by removing minimal amounts of copper.
 
Specially formulated for low-etch/high capacity operations, offers up to 60% reduction in consumption and waste treatment. Featuring a low copper etch factor of 0.9 - 1.1u, copper loss from fine lines and thin copper is reduced, improving performance on controlled impedance. 
 
Other benefits include:
Reduction in consumption and waste treatment;
Increased peel strengths on High Tg dielectrics;
Less frequent bath changes with increased up-time;
Improved yields and reliability.
 
 
Enthone Inc., www.cooksonelectronics.com