Multicore MF210 no clean, halide-free sustained activity flux is formulated to work over a range of solder resists and is compatible with rosin- and OSP-based surface preservatives.
 
Said to offer a maximum process window without resin, which satisfies the demand for applications requiring high performance and reliability. Allows for high-speed soldering on conventional leaded and surface-mount components, good through-hole penetration and optimum wetting of surfaces. 
 
For use in foam, spray or wave fluxes similar to ordinary fluxes on standard wave soldering machines.
 
Meets or exceeds the IPC-TM-650 2.3.32 Copper Mirror Test standard, and meets specifications for J-STD-004 SIR and Bellcore GR-78-CORE electromigration testing.
 
Henkel, loctite.com