In addition lead-free pastes and complementary fluxes for the SMT industry, Heraeus CMD will also introduce the F10B Series of no-clean solder pastes, said to offer exceptional print-to-print consistency and wetting capabilities. The series is the latest in the line of solder pastes, tack fluxes and SMT adhesives required in demanding surface mount manufacturing processes.

Also on display will be the full line of fluxes for reworking and solder ball attachment for no-clean and water-soluable applications. These fluxes feature extreme purity to ensure realiability.

Heraeus Circuit Materials Division (CMD), Nepcon East Booth 5024

 

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