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Henkel Introduces Several Multicore Liquid Fluxes
Designed mainly for consumer electronics applications using conventional or nitrogen inerted wave soldering systems, Multicore MF101 and MF300 are VOC-free, high activity, no-clean liquid fluxes that meet the legislation on volatile organic compound (VOC) emissions (<1% VOC). Both perform well on low solderability surfaces such as oxidized copper, are formulated to minimize or eliminate solder balling and are non-flammable. MF101 is suitable for spray application only and MF300 can be applied by spray or foam.
MF200 liquid flux is ideal for consumer electronic products and general electrical lead-free soldering applications, especially where there has been a high level of mid-pad solder balling. Said to significantly reduce or eliminate micro solder balling. May also be used with lead-containing alloys.MFR301 no clean, sustained activity flux is for fast soldering on conventional leaded and SMD components. The activator package is similar to a previous product, but the acid value has been increased to enhance efficacy when soldering to poorly preserved substrates and components. Ensures optimum drainage characteristics at the exit of the wave, which minimizes bridges, spiking and mid-pad solder balling. Can be applied by foam, spray or wave.
Henkel, www.henkelelectronics.com
