Delivering electrical conductivity for attachment of ICs and components to metallic lead frames, Loctite QMI529HT is a highly silver filled conductive adhesive designed to provide high thermal conductivity. Hydrophobic and high-temperature stability characteristics produce void-free bond lines with adhesive strength, enabling adhesion to a variety of metals and ceramic surfaces, including copper, silver-plated copper and pre-plated leadframes. The bismaleimide (BMI) formulation also said to have particularly robust adhesion to NiPdAu leadframes.
 
Designed as a soft-solder replacement or for applications that require high thermal or electrical conductivity, reportedly achieves UPHs that are higher than conventional oven cured adhesives.  With e fast cure kinetics and very low volatiles, can be SkipCured on the diebonder or wirebonder preheater. 
 
To control bondlines and fillet heights, can also be converted into a controlled collapse spacer paste. 
 
Henkel, www.henkelelectronics.com