Tokyo, Japan --  Nihon Almit Co., Ltd., a manufacturer of solder wire and paste, has created two new Pb-free solder pastes to eliminate VOIDE. TM-HP has high preheat 200°C for 120 sec., and TM-HP (L) features high preheat 190°C for 120 sec.

The pastes are manufactured in accordance with IPC TM-650 and IPC J-STD 005.  The main stream alloy in Pb-free soldering is Sn/Ag/Cu and is available in variations such as: Ag3.0% / Cu0.5%, Ag3.9% / Cu 0.6%  (NEMI recommended) and Ag3.5% / Cu 0.7%.

Nihon Almit will attend the CAVE Harsh Environment Workshop in Indianapolis on June to speak on various aspects of Sn/Ag/Cu alloys. 

The company recently announced that leading Japanese automotive manufacturers have decided to specify Almit Pb-free solder for many of their applications.

For questions, contact ANA Trading Corp. U.S.A.: almit@anatu.com or (310) 965-8165.