Polyclad Laminates Inc., a business of Cookson Electronics, has introduced Polyclad 250HR laminate and prepreg materials. With a 150°C glass transition temperature (Tg) and 350°C decomposition temperature (Td), is suited for mid-Tg, lead-free applications. The CAF-resistant materials maintain low expansion rates while retaining FR-4 processability.
 
Used in the manufacture of automobiles, computer servers, telecommunications devices and other electronics, said to offer exceptional IST thermal performance and reliability. Contains a multifunctional epoxy resin technology for reduced CTE.
 
Compatible with all commonly used FR-4 fabrication process techniques. Mechanical, chemical and moisture resistance meet or exceed the performance of competitive FR-4 material. Is laser fluorescing and UV blocking for maximum compatibility with AOI systems, optical positioning systems and photoimageable solder mask imaging.
 
Polyclad Laminates, www.polyclad.com