DEK has reportedly applied its mass imaging techniques to improve the uniformity of Thermal Interface Material (TIM) deposited between a silicon die and its package lid during semiconductor packaging.  By using ProFlow DirEKt Imaging to mass image the TIM, semiconductor manufacturers can ensure uniform material thickness across the entire die surface. Advantages include better thermal conductivity between the die and the lid, which improves reliability and delivers greater lid coplanarity.
 
"Mass imaging is significantly more controllable and repeatable than traditional dispensing when depositing TIM," says Richard Heimsch, president.  "Additionally, DEK's process makes it easier to verify uniform spreading and absence of voids before the package lid is assembled."
 
During the TIM process, die assembled onto substrates enter a flexible printing system that combines three processes - passive attach, TIM and lid sealing - into a single platform. The single  printing system allows customers to re-deploy equipment between processes to meet changing manufacturing requirements and allows single-platform operator training. 
 
Compared to traditional, serial dispensing, the parallel mass imaging process is said to increase true throughput and deliver greater control over the volume of material deposited.  This technique also allows the shape of the TIM deposit to be more accurately controlled.  Because the process does not require the TIM to be spread via lid placement, defects such as material voids or incomplete spreading are reportedly eliminated.  
 
DEK, dek.com