Use a double-sided, multi-layer flexible circuit with embedded interconnect technology folded around a rigid thermal core to increase the available area for mounting devices while enhancing thermal management, reliability and thinness.
Aluminum core acts as a heat sink and mechanical stiffener to provide rigid foundation support and increase the contact area for dissipating heat away from the devices. Heat reductions range from 4 to 25°C, said to minimize BGA ball stress cracking and reduce wear and tear through the use of a tapered connector edge that lessens system insertion stress. 
 
Complements all types of standard memory devices, from DDR1 and DDR2 to dual-die, stacked or planar packages. Also has applications in mixed environments that use various chip technologies, such as DSPs, controllers and ASIC processors.