ALPHA CoolCap was developed to cool components and semiconductor packages during high-temperature lead-free rework and reflow processes.
 
Provides protection for adjacent components during rework and protection for targeted components during reflow.
 
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics.  “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
 
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components. 

Cookson Electronics Assembly Materials, alphametals.com.