The portable USC 400 ultrasonic cleaning system can be taken directly to the stencil printer to clean stencil apertures without the need to reset and calibrate the printer. When the system is offline, it can be used in conjunction with a bench-mounted or stand-alone stencil cleaner.
 
Features Direct On-Contact Ultrasonic Cleaning to remove Pb-free solder paste particles trapped within stencil apertures.
 
Benefits include: minimal use of fluids, total aperture penetration, no risk of stencil damage and robust construction. Can be used with solder paste or SMD adhesives, is suitable for stainless and plastic stencils. Cleans pick-and-place nozzles, dispensing needles and probe test pins, and can soften solder paste.

An ultrasonic cup with a dwell timer is optional.