PCB049 board and kit can evaluate mixed-technology Pb-free assembly. Tests a variety of JEDEC and EIAJ components.
 
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance.