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TherMoire PS200 lab tool is the result of customer feedback and changing industry needs. The new JEDEC standard for temperature-dependent warpage measurement of packages (JESD22B112) now requires faster heating and cooling rates, and this tool delivers improvements in both. Allows the user to more precisely replicate a temperature profile, while taking real-time flatness measurements. New ergonomic design and better user interface improve ease-of-use.

LineMoire PS16 is a room-temperature flatness measurement system, designed for both QA/QC and high-volume production settings. Capable of both package and PCB flatness measurements.  Can measure global and local area warpage with a 1 sec. data acquisition time.

AkroMetrix, akrometrix.com

Booth 1451