Alphasem has introduced a tape applicator module for the Swissline 9022 die bonder series. Offers process control and high productivity.
 
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
 
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
 
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.