Syon electrically conductive adhesive solders can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. The epoxy and epoxide formulations mix and pour easily, fill voids and cure with minimal air entrapment. Reportedly provide environmental and impact resistance.
 
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is one to three hours. Cure time is 72 hours at 75° F or 2 hours at 130° F.  Can be used in service temperatures from -65° to 200° F.
 
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications where a conductive bond is required and where hot soldering is impractical. Can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Is also for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is one hour; cure time is 24 hrs at room temperature. Can be used in temperatures from  -65° to 200° F.
 
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding as well as in heat-sink applications. Has a pot life of 45 min. Although it cures at room temperature, heating the adhesive to 150° F for 2 hours speeds curing and ensures electrical conductivity. Can be used in temps from  -65° to 200° F.
 
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