Merit Sensor has received its first Alphasem EasyLine 8088 “Sensor Bonder.” The machine will play a role in the ramp-up of its new production site in Utah. The sensors to be produced at this site are mainly for medical applications (such as blood pressure sensors.)
 
According to a press release, the process control and high throughput of the machine were decisive selling points, as were the handling of ceramic substrates and the die technology. The machine enables Merit to boost pressure sensor output.
 
The equipment is based on the EasyLine platform and features high-speed air bearing pick-and -place, closed-loop linear motor pick tool for bond line thickness control and fully automatic wafer handling system. To meet demands in the field of MEMS and sensors, an active Theta control of the bond head has been implemented.
 
Merit Sensor Systems, www.merit-sensor.com