Visitors to DEK’s booth at Semicon West show will see live demonstrations of the company’s DirEKt Ball Placement process. Utilizing two in-line Micron-class platforms, this technology enables the placement of solder balls as small as 0.3 mm in diameter onto substrates or wafers at repeatable first-pass yields better than 99%. The first in-line system, a Europa, uses flux imaging technology to deposit flux precisely at each interconnect site.  The second machine, a Galaxy, then uses a fully enclosed ball transfer head capable of holding up to 50 million solder balls to guide each solder ball directly to the surface of the stencil and seat each ball in the flux. Process cycle time is fast, regardless of I/O count.
 
The platform is not limited to ball placement and wafer bumping processes. It hosts a variety of advanced packaging applications such as backside wafer coating, thermal interface materials (TIM) deposition and encapsulation. Some applications include high-speed backside wafer coating of die attach materials, epoxies and protective coatings as thin as 25 microns and singulated substrate printing that allows for the individual alignment and imaging of multiple substrates or components down to 20mm. 
 
DEK, dek.com
Semicon West Booth #7139