AkroMetrix will display its latest product, the LineMoiré automated flatness measurement system, Model J5000, at Semicon West booth #8301. 
 
The high-speed, full-field shadow moiré technique allows for flatness measurement of chip-carriers/substrates, packages and ICs in JEDEC (or similar) trays. Can measure the full contents of a tray simultaneously (with one-sec. data acquisition time per tray), has integrated tray stack/destack and part sorting capabilities. Can measure stacks of trays, replace “bad” parts (i.e., parts that fail a user-specified warpage specification) with known good parts, and then stack good and bad trays separately. This is important for incoming/outgoing inspection of parts.  Enables flatness characterization before any value added processing is performed.