Henkel has developed a die attach and mold compound material set that is Pb-free compatible and designed for thin and ultra-thin surface-mount device applications.
 
Combined, the Hysol QMI529LS die attach material and Hysol GR828A mold compound deliver the thin, yet highly reliable, materials properties necessary for packages in  low-profile products such as cell phones, PDAs, portable music players and entertainment devices . 
 
When manufacturing TSOP, TSSOP and TQFP packages with Au-plated and Ag-plated lead frames, use of the die attach adhesive with the “Green” mold compound reportedly produces superior material set reliability and performance. QMI529LS’ formulation provides hydrophobic properties, while delivering stability at high temperatures. GR828A is a low stress molding compound that exhibits excellent gate leakage performance. Testing of this materials combination to JEDEC Level 1, 260°C has confirmed robust performance even in demanding Pb-free manufacturing conditions. 
 
Henkel,is one of the world’s leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across electronics.henkel.com