Axiom X-1022 Dual-Lane dispensing system maximizes throughput during multi-pass underfill operations. Increases the number of units per hour (UPH) produced in high-volume semiconductor applications such as flip chip and CSP underfill. Allows parallel processing on two lanes for continuous dispensing, eliminating lost time in non-dispensing activities. In some applications, a 60 to 80% increase in throughput over single-lane dispensers can be achieved.
 
Dual-lane capability allows underfill flow-out in one lane while jetting underfill in the opposite lane. Eliminates wait-time by enabling two dispensing processes at the same time.
 
The conveyors are independently controlled, allowing different-sized parts to be processed in lanes one and two. Programmable flat-belt, dual-lane conveyor allows for a variety of process carriers, including Auer boats, lead frames and custom carriers. Conveyor is SMEMA compliant with a fixed first rail and adjustable second, third and fourth rails. 
 
Configured with up to six stations of contact or impingement heating, three stations per lane: pre-heat, dispense and post-heat. The heat stations ensure consistent substrate heating at specified ramp rates for efficient, reliable fluid dispensing.
 
Fluidmove for Windows XP software offers advancements in throughput, fluid management and process control. For example, the board or substrate is sensed in the pre-dispense station and the associated dispensing program is automatically loaded.
 
Mass Flow Control and Calibrated Process Jetting control the critical aspects of the fluid dispensing process in a closed feedback loop.