EFD’s Solder Paste Group introduces an improved no-clean solder paste product family specifically formulated for SAC 305. Pb-free formulations are known to leave dull, matte finishes, but the new clear, colorless no-clean flux residue allows the solder joint to sparkle. For applications requiring a shiny, cosmetic finish. Said to ease inspection and improve wetting capabilities for SMT, mechanical, electronic and electro-mechanical soldering applications.