S3016 inspects through-hole and surface mount selective solder joints on double-sided PCBs and other similar applications. Detects open solder joints, bridges, missing leads and other defects from below, and eliminates PCB flip stations.  
 
Employs a 6M-camera to maximize inspection depth and speed. An X/Y positioning unit guides the camera module beneath the PCB to capture images from specified locations. Images are evaluated while the camera moves to its next position.
 
Viscom, www.viscom.com