The FS2500N flip chip packaging system is reportedly capable of aligning and bonding at 1.7 sec. per chip at 2 micron accuracy. Underfilling chip with gaps of 14 microns has reportedly been demonstrated in production volume with zero voids. Said to be capable of bonding via thermocompression by pulse heating head, thermosonic by 50 KHz ultrasonic system, Au/Au, Au/Sn and solder. Reported chip sizes of up to 20 x 20 mm with more than 800 bumps and pitches of less than 40 microns.
 
Toray Engineering Co., Ltd., www.toray.com